US 11,817,298 B2
Focus ring, chuck assembly for securing a substrate and plasma treatment apparatus having the same
Incheol Song, Hwaseong-si (KR); Masayuki Tomoyasu, Seongnam-si (KR); Hongmin Yoon, Hwaseong-si (KR); and Jihyun Lim, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd.
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 1, 2020, as Appl. No. 17/108,037.
Claims priority of application No. 10-2020-0036800 (KR), filed on Mar. 26, 2020.
Prior Publication US 2021/0305021 A1, Sep. 30, 2021
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32174 (2013.01); H01J 37/32715 (2013.01); H01J 2237/3341 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A focus ring, comprising:
a first conductive layer having a first thickness and a first specific resistance;
a second conductive layer stacked on the first conductive layer, the second conductive layer having a second thickness greater than the first thickness and a second specific resistance greater than the first specific resistance; and
a dielectric layer on one of a lower surface of the first conductive layer or an upper surface of the second conductive layer,
wherein the second specific resistance is 10 times to 100 times the first specific resistance.