US 11,817,297 B2
System and method for managing substrate outgassing
Matthew Spuller, Belmont, CA (US); and Dongming Iu, Union City, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 6, 2020, as Appl. No. 16/812,144.
Prior Publication US 2021/0280391 A1, Sep. 9, 2021
Int. Cl. H01L 21/66 (2006.01); H01J 37/32 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01); C23C 16/46 (2006.01)
CPC H01J 37/32449 (2013.01) [C23C 16/45557 (2013.01); C23C 16/466 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a thermal processing chamber defining a processing volume;
a gas line coupled to the thermal processing chamber;
an exhaust pump coupled to the thermal processing chamber by an exhaust conduit;
an exhaust flow controller coupled to the exhaust conduit; and
a sampling line coupled to the exhaust conduit, the sampling line comprising an organic compound sensor and a sampling flow control valve, the organic compound sensor being communicatively coupled to the exhaust flow controller.
 
10. A method of processing a substrate comprising,
processing a substrate in a thermal processing chamber using one or more operating parameters;
generating sensor data from a sensor reading of an effluent of the thermal processing chamber using an organic compound sensor;
determining at least one property of the effluent based on the sensor data; and
adjusting the one or more operating parameters for processing the substrate based on the at least one property.
 
15. A system programmed to perform a method, comprising:
an algorithm stored in a memory of the system, wherein the algorithm comprises a number of instructions which, when executed by a processor, causes a method to be performed, comprising:
processing a substrate in a thermal processing chamber using one or more operating parameters;
generating sensor data from a sensor reading of an effluent of the thermal processing chamber using an organic compound sensor;
determining at least one property of the effluent based on the sensor data; and
adjusting the one or more operating parameters for processing the substrate based on the at least one property.