US 11,817,268 B2
Multilayer ceramic electronic component
Gyu Ho Yeon, Suwon-si (KR); Won Kuen Oh, Suwon-si (KR); Seo Won Jung, Suwon-si (KR); and Seo Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 19, 2022, as Appl. No. 17/723,938.
Claims priority of application No. 10-2021-0191599 (KR), filed on Dec. 29, 2021.
Prior Publication US 2023/0207204 A1, Jun. 29, 2023
Int. Cl. H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and internal electrodes;
first electrode layers disposed on the ceramic body and connected to the internal electrodes, respectively; and
second electrode layers disposed on the first electrode layers, respectively, and respectively including a conductive metal including silver and palladium, carbon materials, and glass particles,
wherein an area ratio of the carbon materials in a cross section of at least a portion of each of the second electrode layers is 1 to 5%.