US 11,817,267 B2
Multilayer capacitor
Byung Woo Kang, Suwon-si (KR); Bon Seok Koo, Suwon-si (KR); Jung Min Kim, Suwon-si (KR); Ji Hye Han, Suwon-si (KR); Hye Jin Park, Suwon-si (KR); Sang Wook Lee, Suwon-si (KR); and Hong Je Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 4, 2022, as Appl. No. 17/712,420.
Claims priority of application No. 10-2021-0149608 (KR), filed on Nov. 3, 2021.
Prior Publication US 2023/0135148 A1, May 4, 2023
Int. Cl. H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01); H01G 4/248 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multilayer capacitor, comprising:
a body including a dielectric layer and a first internal electrode and a second internal electrode; and
a first external electrode and a second external electrode, each disposed on an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include: an electrode layer disposed on the body and covering the first and second internal electrodes and the dielectric layer, the electrode layer including a first intermetallic compound directly contacting the first and second internal electrodes, and glass dispersed within the first intermetallic compound; and
a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.