CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/324 (2013.01); H01F 2027/2809 (2013.01)] | 4 Claims |
1. A multilayer coil component, comprising:
an element body;
a coil disposed in the element body;
an external electrode disposed on the element body and electrically connected to the coil; and
a connection conductor disposed in the element body,
wherein the element body includes a principal surface arranged to constitute a mounting surface;
the connection conductor includes one end connected to the coil and another end connected to the external electrode;
the external electrode includes:
a sintered metal layer formed on the element body and in direct contact with the element body,
a conductive resin layer formed on the principal surface to cover the sintered metal layer, and in direct contact with the principal surface and the sintered metal layer, and
a plating layer formed on the conductive resin layer to cover the conductive resin layer, and
an end positioned above the principal surface of the conducive resin layer overlaps the coil, when viewed from a direction orthogonal to the principal surface.
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