	US 11,817,251 B2
	Electronic component
Kun Hoi Koo, Suwon-si (KR); Byung Woo Kang, Suwon-si (KR); Ji Hye Han, Suwon-si (KR); and Bon Seok Koo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 29, 2021, as Appl. No. 17/514,292.
Application 17/514,292 is a continuation of application No. 15/807,001, filed on Nov. 8, 2017, granted, now 11,183,325.
Claims priority of application No. 10-2017-0027157 (KR), filed on Mar. 2, 2017.
Prior Publication US 2022/0051843 A1, Feb. 17, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01)

CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01)]

21 Claims

1. An electronic component comprising:

an internal electrode;

an external electrode connected to the internal electrode; and

a connection layer disposed between the internal electrode and the external electrode,

wherein the external electrode includes a conductive layer having a porous structure, and a resin filled in voids in the porous structure,

wherein the conductive layer contains an Ag—Sn based alloy, so that the external electrode has a continuous network structure including an intermetallic compound, and

wherein the connection layer includes an intermetallic compound, and the intermetallic compound of the connection layer and the intermetallic compound of the external electrode are in direct contact with each other.