US 11,817,144 B2
Arrangements of memory devices and methods of operating the memory devices
Chien-Yuan Chen, Hsinchu (TW); Hau-Tai Shieh, Hsinchu (TW); Cheng Hung Lee, Hsinchu (TW); and Hung-Jen Liao, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 6, 2021, as Appl. No. 17/313,179.
Prior Publication US 2022/0359000 A1, Nov. 10, 2022
Int. Cl. G11C 11/419 (2006.01); G11C 11/412 (2006.01)
CPC G11C 11/419 (2013.01) [G11C 11/412 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a plurality of memory arrays including a first memory array and a second memory array;
a controller including a plurality of buffers including a first buffer connected to the first memory array and a second buffer connected to the second memory array, wherein the first and second memory arrays are disposed on opposing sides of the controller;
a reset clock generator configured to generate a first signal;
a sense amplifier enable (SAE) generator configured to generate a second signal based on the first signal; and
a plurality of interconnect structures including:
a first interconnect structure extending in a first direction and connected to the first buffer;
a second interconnect structure extending in the first direction and connected to the second buffer, wherein the first and second interconnect structures are disposed in a first metal layer, and wherein the reset clock generator and the SAE generator are interposed between the first buffer and the second buffer; and
a third interconnect structure connected to the first and second interconnect structures and extending in a second direction that is substantially perpendicular to the first direction, wherein the third interconnect structure, disposed in a second metal layer, is electrically connected to the controller,
wherein respective lengths of the first interconnect structure and the second interconnect structure are substantially the same.