US 11,816,301 B2
Electronic apparatus including sensing coil and manufacturing method of the same
Hirotsugu Kishimoto, Hwaseong-si (KR); and Hyun-Been Hwang, Suwon-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Oct. 25, 2022, as Appl. No. 17/972,886.
Application 17/972,886 is a continuation of application No. 17/092,709, filed on Nov. 9, 2020, granted, now 11,513,653.
Claims priority of application No. 10-2020-0026142 (KR), filed on Mar. 2, 2020.
Prior Publication US 2023/0048565 A1, Feb. 16, 2023
Int. Cl. G06F 3/046 (2006.01); G06F 3/044 (2006.01)
CPC G06F 3/046 (2013.01) [G06F 3/0447 (2019.05); G06F 2203/04103 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
a window;
a display panel disposed on a lower surface of the window; and
a digitizer disposed on a lower surface of the display panel,
wherein the digitizer includes:
a first resin layer;
a first sensing coil disposed on one surface of the first resin layer;
a second resin layer disposed spaced apart from the first resin layer; and
a first adhesive layer disposed between the first resin layer and the second resin layer and which adheres the first resin layer and the second resin layer; and
a second sensing coil disposed spaced apart from the first adhesive layer, and at least a portion of the second resin layer is disposed between the second sensing coil and the first adhesive layer,
wherein each of the first resin layer and the second resin layer has a storage modulus of about 0.5 Gigapascal (GPa) to about 2 GPa.