US 11,815,733 B2
Optical unit
Takeshi Sue, Nagano (JP); Masato Gomyo, Nagano (JP); and Shinji Minamisawa, Nagano (JP)
Assigned to NIDEC SANKYO CORPORATION, Nagano (JP)
Appl. No. 17/264,853
Filed by NIDEC SANKYO CORPORATION, Nagano (JP)
PCT Filed Jul. 5, 2019, PCT No. PCT/JP2019/026757
§ 371(c)(1), (2) Date Feb. 1, 2021,
PCT Pub. No. WO2020/031578, PCT Pub. Date Feb. 13, 2020.
Claims priority of application No. 2018-147752 (JP), filed on Aug. 6, 2018.
Prior Publication US 2021/0215900 A1, Jul. 15, 2021
Int. Cl. G02B 7/02 (2021.01); G02B 27/64 (2006.01); G03B 5/06 (2021.01); G03B 17/55 (2021.01)
CPC G02B 7/028 (2013.01) [G02B 27/646 (2013.01); G03B 5/06 (2013.01); G03B 17/55 (2013.01); G03B 2205/0023 (2013.01); G03B 2205/0069 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An optical unit comprising:
a movable body comprising an optical module; and
a fixed body which holds the movable body in a displaceable state;
wherein the movable body comprises:
a circuit board, provided in the optical module; and
at least one heat radiation member formed of metal material, disposed in a periphery of the optical module;
wherein the circuit board is disposed on an opposite side of the optical module to an object side, and the circuit board is provided with a protruded part which is protruded with respect to the optical module in a direction intersecting an optical axis of the optical module;
the heat radiation member is directly placed on and contacted with the protruded part of the circuit board, so that the heat radiation member is capable of radiating heat of the circuit board through a contacted portion of the heat radiation member with the circuit board;
an outer circumferential edge part of the circuit board is provided with a plurality of recessed parts which are recessed toward the heat radiation member from an outer circumferential edge of the protruded part to an inner side of the protruded part;
a metal foil formed on the recessed part and the heat radiation member formed of metal material are connected with each other by a solder, and thereby, heat generated in the circuit board is conducted from the recessed part to the heat radiation member through the solder, and the heat radiation member and the circuit board are fixed to each other by the solder.