CPC G01P 21/00 (2013.01) [G01P 15/09 (2013.01)] | 15 Claims |
1. A method comprising:
measuring a temperature of a semiconductor die, in which the semiconductor die includes a piezoelectric device, a pyroelectric device, and a memory;
receiving a signal from the pyroelectric device;
based on the signal and the temperature, determining a calibration parameter of the piezoelectric device; and
storing the calibration parameter into the memory.
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