US 11,815,414 B2
Pressure sensor devices and methods for manufacturing pressure sensor devices
Emanuel Stoicescu, Bucharest (RO); Matthias Boehm, Putzbrunn (DE); Stefan Jahn, Munich (DE); Erhard Landgraf, Dresden (DE); Michael Weber, Mainburg (DE); and Janis Weidenauer, Munich (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jun. 16, 2021, as Appl. No. 17/348,940.
Application 17/348,940 is a continuation of application No. 16/159,918, filed on Oct. 15, 2018, granted, now 11,067,466.
Claims priority of application No. 102017124092.6 (DE), filed on Oct. 17, 2017; and application No. 102018106560.4 (DE), filed on Mar. 20, 2018.
Prior Publication US 2021/0310890 A1, Oct. 7, 2021
Int. Cl. G01L 19/14 (2006.01); H01L 23/053 (2006.01); G01L 19/00 (2006.01); H01L 21/56 (2006.01); H01L 23/24 (2006.01); H01L 23/495 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01)
CPC G01L 19/147 (2013.01) [G01L 19/0061 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 23/60 (2013.01); H01L 24/45 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/4848 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/00014 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A pressure sensor device, comprising:
a semiconductor die having a first die surface that comprises a pressure sensor area and a second die surface arranged opposite to the first die surface; and
a bond wire bonded to a first peripheral region of the first die surface and extends over the first die surface to a second peripheral region of the first die surface, wherein the pressure sensor area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the first die surface, wherein the crossing portion extends over the pressure sensor area that is interposed between the first and the second peripheral regions, and wherein the crossing portion is closer to the pressure sensor area than to the second die surface,
wherein the second peripheral region is catty-corner to the first peripheral region and the crossing portion extends diagonally over the pressure sensor area that is diagonally interposed between the first and the second peripheral regions, or
wherein the second peripheral region is arranged laterally opposite to the first peripheral region with respect to the pressure sensor area, wherein the pressure sensor area has a first lateral side and a second lateral side arranged opposite to the first lateral side, and wherein the crossing portion extends laterally over the pressure sensor area that is laterally interposed between the first and the second peripheral regions such that the crossing portion extends over the first lateral side and the second lateral side of the pressure sensor area.