	US 11,815,252 B2
	Light-emitting device
Ming Chen, Shanghai (CN); Xing Wen, Shanghai (CN); Shan Li, Shanghai (CN); Peng Wang, Shanghai (CN); and Xiaoliang He, Shanghai (CN)
Assigned to SHANGHAI SANSI ELECTRONIC ENGINEERING CO. LTD., Shanghai (CN); SHANGHAI SANSI TECHNOLOGY CO. LTD., Shanghai (CN); JIASHAN SANSI OPTOELECTRONIC TECHNOLOGY CO. LTD., Zhejiang (CN); and PUJIANG SANSI OPTOELECTRONIC TECHNOLOGY CO. LTD., Zhejiang (CN)
Filed by SHANGHAI SANSI ELECTRONIC ENGINEERING CO. LTD., Shanghai (CN); SHANGHAI SANSI TECHNOLOGY CO. LTD., Shanghai (CN); JIASHAN SANSI OPTOELECTRONIC TECHNOLOGY CO. LTD., Zhejiang (CN); and PUJIANG SANSI OPTOELECTRONIC TECHNOLOGY CO. LTD., Zhejiang (CN)
Filed on Jul. 11, 2022, as Appl. No. 17/861,849.
Claims priority of application No. CN202121573363 (CN), filed on Jul. 12, 2021.
Prior Publication US 2023/0007892 A1, Jan. 12, 2023
Int. Cl. F21V 29/56 (2015.01); F21Y 115/10 (2016.01)

CPC F21V 29/56 (2015.01) [F21Y 2115/10 (2016.08)]

9 Claims

1. A light-emitting device, comprising:

a shell assembly;

a heat dissipation assembly, comprising a first heat dissipation portion and a second heat dissipation portion; wherein the first heat dissipation portion is connected with the second heat dissipation portion, the first heat dissipation portion is used to load a light source assembly, and a cavity space is formed when the second heat dissipation portion is covered by and communicated with the shell assembly;

wherein the second heat dissipation portion is provided with a first through-hole portion, and the shell assembly is provided with a second through-hole portion, the first through-hole portion and the second through-hole portion being used to circulate a cooling medium to remove heat from the cavity space; and

wherein an outside of the second heat dissipation portion is provided with a plurality of outer heat dissipation fins circumferentially; an accommodation space formed between two adjacent outer heat dissipation fins is used to accommodate the first heat dissipation portion.