CPC C25D 21/08 (2013.01) [C25D 5/48 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01); H01L 21/02068 (2013.01); H01L 21/2885 (2013.01)] | 20 Claims |
1. An electroplating apparatus comprising:
a plating bath vessel;
a head configured to support a substrate;
a rinsing frame extending above the plating bath vessel and defining a central aperture through which the head extends into the rinsing frame to access the plating bath vessel, the rinsing frame comprising:
a rim coupled with and extending circumferentially above an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel; and
a rinsing assembly comprising:
a splash guard translatable from a recessed first position to a second position between the rim of the rinsing frame and the plating bath vessel, and
a fluid nozzle coupled with the splash guard, wherein when the splash guard is in the second position, a central axis of the fluid nozzle is positioned below and aligned with a central axis of the head.
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