US 11,814,744 B2
Substrate cleaning components and methods in a plating system
Nolan Zimmerman, Kalispell, MT (US); Gregory J. Wilson, Kalispell, MT (US); Andrew Anten, Whitefish, MT (US); Richard W. Plavidal, Kalispell, MT (US); Eric J. Bergman, Kalispell, MT (US); Tricia Youngbull, Kalispell, MT (US); Timothy Gale Stolt, Kalispell, MT (US); and Sam Lee, Kalispell, MT (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 29, 2019, as Appl. No. 16/370,265.
Claims priority of provisional application 62/650,194, filed on Mar. 29, 2018.
Prior Publication US 2019/0301049 A1, Oct. 3, 2019
Int. Cl. C25D 21/08 (2006.01); C25D 5/48 (2006.01); H01L 21/02 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); H01L 21/288 (2006.01)
CPC C25D 21/08 (2013.01) [C25D 5/48 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01); H01L 21/02068 (2013.01); H01L 21/2885 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electroplating apparatus comprising:
a plating bath vessel;
a head configured to support a substrate;
a rinsing frame extending above the plating bath vessel and defining a central aperture through which the head extends into the rinsing frame to access the plating bath vessel, the rinsing frame comprising:
a rim coupled with and extending circumferentially above an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel; and
a rinsing assembly comprising:
a splash guard translatable from a recessed first position to a second position between the rim of the rinsing frame and the plating bath vessel, and
a fluid nozzle coupled with the splash guard, wherein when the splash guard is in the second position, a central axis of the fluid nozzle is positioned below and aligned with a central axis of the head.