US 11,814,732 B2
Hot-dip plated steel
Takuya Mitsunobu, Tokyo (JP); Mamoru Saito, Tokyo (JP); Kohei Tokuda, Tokyo (JP); and Hiroshi Takebayashi, Tokyo (JP)
Assigned to Nippon Steel Corporation, Tokyo (JP)
Appl. No. 18/009,015
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Sep. 7, 2021, PCT No. PCT/JP2021/032749
§ 371(c)(1), (2) Date Dec. 8, 2022,
PCT Pub. No. WO2023/037396, PCT Pub. Date Mar. 16, 2023.
Prior Publication US 2023/0203635 A1, Jun. 29, 2023
Int. Cl. C23C 2/06 (2006.01); C23C 2/28 (2006.01); C22C 18/04 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C22C 18/00 (2006.01); C23C 2/26 (2006.01); C23C 28/02 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); C21D 1/26 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01)
CPC C23C 2/06 (2013.01) [B32B 15/013 (2013.01); B32B 15/016 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 1/26 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 28/025 (2013.01); C23C 28/3225 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/26 (2015.01)] 4 Claims
OG exemplary drawing
 
1. A hot-dip plated steel comprising:
a base steel; and
a hot-dip plating layer disposed on a surface of the base steel,
wherein a chemical composition of the hot-dip plating layer is, by mass %,
Al: 10.00% to 30.00%,
Mg: 3.00% to 12.00%,
Sn: 0% to 2.00%,
Si: 0% to 2.50%,
Ca: 0% to 3.00%,
Ni: 0% or more and less than 0.25%,
Cr: 0% or more and less than 0.25%,
Ti: 0% or more and less than 0.25%,
Co: 0% or more and less than 0.25%,
V: 0% or more and less than 0.25%,
Nb: 0% or more and less than 0.25%,
Cu: 0% or more and less than 0.25%,
Mn: 0% or more and less than 0.25%,
Bi: 0% or more and less than 5.000%,
In: 0% or more and less than 2.00%,
Y: 0% to 0.50%,
La: 0% or more and less than 0.50%,
Ce: 0% or more and less than 0.50%,
Fe: 0% to 5.00%,
Sr: 0% or more and less than 0.50%,
Sb: 0% or more and less than 0.50%,
Pb: 0% or more and less than 0.50%, and
B: 0% or more and less than 0.50%,
a remainder includes Zn and impurities,
a metallographic structure of the hot-dip plating layer contains 5 to 45 area % of an α phase having a grain diameter of 0.5 to 2 μm,
the metallographic structure of the hot-dip plating layer contains 15 to 70 area % of a MgZn2 phase, and
among the α phase having the grain diameter of 0.5 to 2 μm, an area ratio of the α phase having a (111)α//(0001)MgZn2 orientation relationship to the adjacent MgZn2 phase is 25% to 100%.