CPC C23C 2/06 (2013.01) [B32B 15/013 (2013.01); B32B 15/016 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 1/26 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 28/025 (2013.01); C23C 28/3225 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/26 (2015.01)] | 4 Claims |
1. A hot-dip plated steel comprising:
a base steel; and
a hot-dip plating layer disposed on a surface of the base steel,
wherein a chemical composition of the hot-dip plating layer is, by mass %,
Al: 10.00% to 30.00%,
Mg: 3.00% to 12.00%,
Sn: 0% to 2.00%,
Si: 0% to 2.50%,
Ca: 0% to 3.00%,
Ni: 0% or more and less than 0.25%,
Cr: 0% or more and less than 0.25%,
Ti: 0% or more and less than 0.25%,
Co: 0% or more and less than 0.25%,
V: 0% or more and less than 0.25%,
Nb: 0% or more and less than 0.25%,
Cu: 0% or more and less than 0.25%,
Mn: 0% or more and less than 0.25%,
Bi: 0% or more and less than 5.000%,
In: 0% or more and less than 2.00%,
Y: 0% to 0.50%,
La: 0% or more and less than 0.50%,
Ce: 0% or more and less than 0.50%,
Fe: 0% to 5.00%,
Sr: 0% or more and less than 0.50%,
Sb: 0% or more and less than 0.50%,
Pb: 0% or more and less than 0.50%, and
B: 0% or more and less than 0.50%,
a remainder includes Zn and impurities,
a metallographic structure of the hot-dip plating layer contains 5 to 45 area % of an α phase having a grain diameter of 0.5 to 2 μm,
the metallographic structure of the hot-dip plating layer contains 15 to 70 area % of a MgZn2 phase, and
among the α phase having the grain diameter of 0.5 to 2 μm, an area ratio of the α phase having a (111)α//(0001)MgZn2 orientation relationship to the adjacent MgZn2 phase is 25% to 100%.
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