US 11,814,723 B2
Stabilized metal monolayer structure
Myung Mo Sung, Seoul (KR); Hong Bum Kim, Seoul (KR); Jin Won Jung, Suwon-si (KR); and Kyu Seok Han, Seoul (KR)
Assigned to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), Seoul (KR)
Filed by IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), Seoul (KR)
Filed on Oct. 22, 2018, as Appl. No. 16/166,500.
Application 16/166,500 is a continuation of application No. PCT/KR2017/004259, filed on Apr. 21, 2017.
Claims priority of application No. 10-2016-0048681 (KR), filed on Apr. 21, 2016; and application No. 10-2017-0051353 (KR), filed on Apr. 21, 2017.
Prior Publication US 2019/0055644 A1, Feb. 21, 2019
Int. Cl. C23C 16/02 (2006.01); C23C 16/06 (2006.01); C23C 16/455 (2006.01); B32B 5/04 (2006.01); B82B 1/00 (2006.01); C23C 16/08 (2006.01); B32B 15/00 (2006.01); C23C 16/56 (2006.01); B05D 1/00 (2006.01); B05D 7/00 (2006.01); B32B 7/04 (2019.01); C23C 16/44 (2006.01); B32B 7/02 (2019.01); C23C 30/00 (2006.01); B32B 15/04 (2006.01); C23C 16/14 (2006.01); B32B 7/025 (2019.01); C23C 16/18 (2006.01); C23C 16/16 (2006.01); B82B 3/00 (2006.01)
CPC C23C 16/0272 (2013.01) [B05D 1/60 (2013.01); B05D 7/52 (2013.01); B32B 7/02 (2013.01); B32B 7/025 (2019.01); B32B 7/04 (2013.01); B32B 15/00 (2013.01); B32B 15/04 (2013.01); C23C 16/0281 (2013.01); C23C 16/06 (2013.01); C23C 16/08 (2013.01); C23C 16/14 (2013.01); C23C 16/16 (2013.01); C23C 16/18 (2013.01); C23C 16/44 (2013.01); C23C 16/455 (2013.01); C23C 16/45525 (2013.01); C23C 16/45527 (2013.01); C23C 16/45555 (2013.01); C23C 16/45557 (2013.01); C23C 16/56 (2013.01); C23C 30/00 (2013.01); B82B 1/001 (2013.01); B82B 1/008 (2013.01); B82B 3/0009 (2013.01); B82B 3/0019 (2013.01); B82B 3/0038 (2013.01); B82B 3/0066 (2013.01); B82B 3/0095 (2013.01); Y10T 428/1284 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12826 (2015.01); Y10T 428/12833 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/26 (2015.01); Y10T 428/261 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/268 (2015.01)] 10 Claims
OG exemplary drawing
 
1. A two-dimensional elementary metal structure comprising:
an elementary metal layer formed using ALD (Atomic Layer Deposition) having 3 to 15 atomic layers and having a two-dimensional structure, wherein the elementary metal layer is formed of a metal selected from Group 4 metals, Group 5 metals, and Group 6 metals; and
organic molecular layers provided on a top surface and a bottom surface of the elementary metal layer,
wherein each of the organic molecular layers include a bifunctional group or trifunctional group including a chalcogen element and are formed using MLD (Molecular Layer Deposition),
wherein the elementary metal layer is chemically bonded to the chalcogen element of the organic molecular layers,
wherein the elementary metal layer has a metallic property according to X-ray photoelectron spectroscopy (XPS) analysis even though the elementary metal layer is chemically bonded to the chalcogen element of the organic molecular layers, and
wherein the elementary metal layer has semiconductor properties.