	US 11,814,561 B2
	Dry etching gas composition comprising sulfur-containing fluorocarbon compound having unsaturated bond and dry etching method using the same
Hisashi Shimizu, Gunma (JP); and Korehito Kato, Gunma (JP)
Assigned to KANTO DENKA KOGYO CO., LTD., Tokyo (JP)
Appl. No. 17/288,248
Filed by KANTO DENKA KOGYO CO., LTD., Tokyo (JP)
PCT Filed Oct. 25, 2019, PCT No. PCT/JP2019/041824 § 371(c)(1), (2) Date Apr. 23, 2021, PCT Pub. No. WO2020/085468, PCT Pub. Date Apr. 30, 2020.
Claims priority of application No. 2018-202091 (JP), filed on Oct. 26, 2018.
Prior Publication US 2021/0391178 A1, Dec. 16, 2021
Int. Cl. C09K 13/00 (2006.01); H01L 21/3065 (2006.01)

CPC C09K 13/00 (2013.01) [H01L 21/3065 (2013.01)]

10 Claims

1. A dry etching gas composition consisting of a sulfur-containing fluorocarbon compound that has an unsaturated bond and that is represented by general formula (1) of C_xF_yS_zwherein x, y, and z are 2≤x≤5, y≤2x, and 1≤z≤2, and optionally, at least one compound selected from the group consisting of:

at least one oxygen-containing compound selected from the group consisting of O₂, O₃; CO, CO₂, NO, NO₂, SO₂, and SO₃;

at least one inert gas;

at least one fluorocarbon (FC); and

at least one hydrofluorocarbon (HFC),

wherein said dry etching gas composition comprises the sulfur-containing fluorocarbon compound in an amount of 1 to 100 vol %.