US 11,814,502 B2
Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board
Akihiro Yamauchi, Osaka (JP); Eiichiro Saito, Osaka (JP); Nobuo Shibata, Osaka (JP); and Kouichi Aoki, Hyogo (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/771,079
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Oct. 21, 2020, PCT No. PCT/JP2020/039516
§ 371(c)(1), (2) Date Apr. 22, 2022,
PCT Pub. No. WO2021/079900, PCT Pub. Date Apr. 29, 2021.
Claims priority of application No. 2019-194706 (JP), filed on Oct. 25, 2019.
Prior Publication US 2022/0372245 A1, Nov. 24, 2022
Int. Cl. C08K 3/26 (2006.01); C08J 5/24 (2006.01); C08K 3/22 (2006.01); C08K 9/06 (2006.01); C08L 63/00 (2006.01)
CPC C08K 3/26 (2013.01) [C08J 5/249 (2021.05); C08K 3/22 (2013.01); C08K 9/06 (2013.01); C08L 63/00 (2013.01); C08J 2363/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/267 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A resin composition containing a thermosetting resin (A) and an inorganic filler (B),
the inorganic filler (B) including: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1),
the first filler (B1) including an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2),
proportion of the first filler (B1) relative to a total solid content in the resin composition being equal to or greater than 50% by volume and equal to or less than 90% by volume,
proportion of the second filler (B2) relative to the total solid content in the resin composition being equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.