US 11,813,716 B2
Substrate processing apparatus having chamber cover
Jwahyeon Kim, Cheonan-si (KR); Sungjoon Joo, Cheonan-si (KR); Bongsu Cho, Asan-si (KR); and Kyungho Ha, Cheonan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 31, 2022, as Appl. No. 17/709,941.
Claims priority of application No. 10-2021-0093462 (KR), filed on Jul. 16, 2021.
Prior Publication US 2023/0017080 A1, Jan. 19, 2023
Int. Cl. B24B 55/06 (2006.01); B24B 37/34 (2012.01)
CPC B24B 55/06 (2013.01) [B24B 37/34 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable;
wherein the dry polishing chamber includes
a polishing device on the turntable, and
a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate,
wherein the particle barrier faces the interception filter, and is between the polishing device and the interception filter.