US 11,813,714 B2
Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same
Hojoong Kim, Yongin-si (KR); Taesung Kim, Seoul (KR); Seokjun Hong, Siheung-si (KR); Junyong Kim, Yongin-si (KR); Donghyuk Jang, Seongnam-si (KR); and Youngjin Hong, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR); and Research & Business Foundation SUNGKYUNKWAN UNIVERSITY, Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 21, 2020, as Appl. No. 17/026,554.
Claims priority of application No. 10-2020-0031290 (KR), filed on Mar. 13, 2020.
Prior Publication US 2021/0283744 A1, Sep. 16, 2021
Int. Cl. B24B 37/26 (2012.01)
CPC B24B 37/26 (2013.01) 6 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing (CMP) apparatus, comprising:
a rotating plate;
a CMP pad on an upper surface of the rotating plate;
a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and
a slurry supply configured to supply slurry to the CMP pad,
wherein the CMP pad includes:
a pad body having a circular plate shape;
a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape;
a plurality of connection grooves connecting the plurality of circular grooves, the plurality of connection grooves each having a linear shape,
the plurality of circular grooves includes:
a first circular groove in a central portion of the pad body,
a second circular groove having a greater diameter than that of the first circular groove,
a third circular groove outside of the second circular groove,
a fourth circular groove having a greater diameter than that of the third circular groove, and
a fifth circular groove at an edge of the pad body,
the plurality of connection grooves includes:
a first connection groove connecting the first circular groove and the second circular groove,
a second connection groove connecting the second circular groove and the third circular groove,
a third connection groove connecting the third circular groove and the fourth circular groove, and
a fourth connection groove connecting the fourth circular groove and the fifth circular groove,
at least one of the first to fourth connection grooves is a radial connection groove extending along a line radial to at least one of the first to fourth circular grooves,
at least one other one of the first to fourth connection grooves is a tangential connection groove extending along a line tangential to at least one of the first to fourth circular grooves,
the at least one radial connection groove is spaced apart from the at least one tangential connection groove in a radial direction by one of the circular grooves, and
the first to fourth connection grooves alternate between being tangential connection grooves and radial connection grooves such that each tangential connection groove is radially adjacent to one of the radial connection grooves.
 
4. A chemical mechanical polishing (CMP) pad, comprising:
a pad body having a circular plate shape;
a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and
a plurality of connection grooves connecting the plurality of circular grooves, the plurality of connection grooves each having a linear shape,
wherein:
the plurality of circular grooves includes:
a first circular groove in a central portion of the pad body,
a second circular groove having a greater diameter than that of the first circular groove,
a third circular groove outside of the second circular groove,
a fourth circular groove having a greater diameter than that of the third circular groove, and
a fifth circular groove at an edge of the pad body,
the plurality of connection grooves includes:
a first connection groove connecting the first circular groove and the second circular groove,
a second connection groove connecting the second circular groove and the third circular groove,
a third connection groove connecting the third circular groove and the fourth circular groove, and
a fourth connection groove connecting the fourth circular groove and the fifth circular groove,
at least one of the first to fourth connection grooves is a radial connection groove extending along a line radial to at least one of the first to fourth circular grooves,
at least one other one of the first to fourth connection grooves is a tangential connection groove extending along a line tangential to at least one of the first to fourth circular grooves,
the at least one radial connection groove is spaced apart from the at least one tangential connection groove in a radial direction by one of the circular grooves, and
the first to fourth connection grooves alternate between being tangential connection grooves and radial connection grooves such that each tangential connection groove is radially adjacent to one of the radial connection grooves.