| US 7,450,037 B2 | ||
| Integrated circuit device and electronic instrument that transfers data through a serial bus | ||
| Hidehiko Yajima, Suwa (Japan); Takemi Yonezawa, Fujimi-cho (Japan); Fumikazu Komatsu, Okaya (Japan); and Mitsuaki Sawada, Suwa (Japan) | ||
| Assigned to Seiko Epson Corporation, Tokyo (Japan) | ||
| Filed on Aug. 24, 2006, as Appl. No. 11/508,872. | ||
| Claims priority of application No. 2005-251631 (JP), filed on Aug. 31, 2005. | ||
| Prior Publication US 2007/0057826 A1, Mar. 15, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H03M 9/00 (2006.01) | ||
| U.S. Cl. 341—100 [341/155] | 20 Claims |
| 1. An integrated circuit device comprising:
a high-speed interface circuit block that transfers data through a serial bus; and
a driver logic circuit block that generates a display control signal;
wherein the high-speed interface circuit block including:
a physical layer circuit including a receiver circuit that receives serial data through the serial bus; and
a high-speed interface logic circuit including a serial/parallel conversion circuit that converts serial data received through
the serial bus into parallel data; wherein
the high-speed interface circuit block being disposed so that the high-speed interface logic circuit is disposed between the
physical layer circuit and the driver logic circuit block and the physical layer circuit and the driver logic circuit block
are not adjacently disposed.
|