| US 7,449,978 B2 | ||
| Printed substrate, and electronic component having shield structure | ||
| Kunio Yamaguchi, Chichibu-gun (Japan); Ryouhei Kimura, Chichibu-gun (Japan); Atsushi Tanaka, Chichibu-gun (Japan); and Kenyu Morozumi, Yokohama (Japan) | ||
| Assigned to Mitsubishi Materials Corporation, Tokyo (Japan); and Matsushita Electric Industrial Co., Ltd., Kadoma-shi (Japan) | ||
| Filed on Aug. 28, 2007, as Appl. No. 11/845,990. | ||
| Application 11/845990 is a division of application No. 10/501934, granted, now 7,280,008, previously published as PCT/JP03/00596, filed on Jan. 23, 2003. | ||
| Claims priority of application No. 2002-016149 (JP), filed on Jan. 24, 2002; application No. 2002-016150 (JP), filed on Jan. 24, 2002; application No. 2002-016151 (JP), filed on Jan. 24, 2002; and application No. 2002-182754 (JP), filed on Jun. 24, 2002. | ||
| Prior Publication US 2007/0297161 A1, Dec. 27, 2007 | ||
| Int. Cl. H03H 9/64 (2006.01); H05K 5/04 (2006.01); H05K 9/00 (2006.01) | ||
| U.S. Cl. 333—193 [333/133; 361/753; 361/758; 361/816; 361/818] | 15 Claims |
| 1. An electronic component comprising a shield structure, comprising:
a printed substrate comprising a fitting region for mounting a filter;
a shield frame member surrounding a periphery of said fitting region;
a filter which is mounted in said fitting region of said printed substrate; and
a protective member which comprises a conductive surface which is in contact with a surface of said filter, the protective
member abutting at its sides against the shield frame member,
wherein said conductive surface is the same size as said surface of said filter, or is smaller than the surface of said filter.
|