US 11,812,577 B2
Electronic device
Yoshitaka Uchida, Hanno (JP)
Assigned to SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo (JP)
Filed by SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo (JP)
Filed on Mar. 8, 2022, as Appl. No. 17/689,588.
Claims priority of application No. 2021-038617 (JP), filed on Mar. 10, 2021.
Prior Publication US 2022/0295656 A1, Sep. 15, 2022
Int. Cl. H05K 7/00 (2006.01); H05K 7/14 (2006.01); H05K 5/02 (2006.01)
CPC H05K 7/1405 (2013.01) [H05K 5/0221 (2013.01); H05K 7/1447 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate at which an electronic component is mounted;
a resin case configured to accommodate the substrate internally; and
a bracket having a flat plate-shaped fixing portion to which the resin case is attached, wherein:
the resin case has an attachment portion into which the fixing portion is inserted,
the attachment portion has a first pressing portion having a convex portion that is inserted into a concave portion of the inserted fixing portion, and a pair of second pressing portions that hold between them respective side faces of the inserted fixing portion,
the resin case is attached to the bracket by insertion of the convex portion into the concave portion, and
leading end sides of the pair of second pressing portions abut the inserted fixing portion and are resiliently deformed in directions away from each other, holding between them the respective side faces of the fixing portion in a state in which the leading end sides have been resiliently deformed.