CPC H05K 3/0041 (2013.01) [B33Y 80/00 (2014.12); C23C 18/02 (2013.01); H05K 3/0032 (2013.01)] | 19 Claims |
1. A method for producing thermally induced graphene sensing circuitry, comprising:
preparing a surface of a component for placement of a coating on the surface;
coating at least a portion of the surface of the component with a first polymeric material that includes carbon;
applying a thermal scan to the coating of the first polymeric material to generate a pattern comprising graphene on the surface of the component, wherein the graphene is generated by the thermal scan, and wherein the pattern forms a printed circuit and comprises a zig-zag shape;
coating at least a second portion of the surface of the component with an electrically-insulating second polymeric material;
defining openings in the coating of the second polymeric material by leaving specific areas of the pattern uncovered when coating at least the second portion of the surface of the component with the electrically-insulating second polymeric material, wherein the openings provide access to the pattern; and
adding electrical connections to the pattern, wherein the electrical connections include at least endpoints to the printed circuit.
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