CPC H05K 1/0228 (2013.01) [H05K 1/0219 (2013.01); H05K 1/114 (2013.01); H05K 1/181 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a dielectric layer;
a first contact pad disposed on the dielectric layer;
a first via disposed through the dielectric layer and coupled to the first contact pad, the first via offset from the first contact pad in a first direction;
a second contact pad disposed on the dielectric layer and immediately adjacent the first via;
a second via disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad, the second via offset from the second contact pad in a second direction that is opposite of the first direction, the first contact pad and the second contact pad comprising a first differential pair of contact pads configured to transmit a first differential pair of signals;
a third contact pad disposed on the dielectric layer;
a third via disposed through the dielectric layer and coupled to the third contact pad, the third via offset from the third contact pad in a third direction that is perpendicular to the first direction;
a fourth contact pad disposed on the dielectric layer and separated from the third contact pad by the first differential pair of contact pads; and
a fourth via disposed through the dielectric layer and coupled to the fourth contact pad, the fourth via offset from the fourth contact pad in a fourth direction that is perpendicular to the first direction, the third contact pad and the fourth contact pad configured to be coupled to ground.
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