US 11,812,544 B2
Breakout structure for an integrated circuit device
Shad Shepston, Broomfield, CO (US); and Robert Andrew Daniels, March (GB)
Assigned to XILINX, INC., San Jose, CA (US)
Filed by XILINX, INC., San Jose, CA (US)
Filed on Dec. 21, 2021, as Appl. No. 17/557,877.
Prior Publication US 2023/0199941 A1, Jun. 22, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0228 (2013.01) [H05K 1/0219 (2013.01); H05K 1/114 (2013.01); H05K 1/181 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a dielectric layer;
a first contact pad disposed on the dielectric layer;
a first via disposed through the dielectric layer and coupled to the first contact pad, the first via offset from the first contact pad in a first direction;
a second contact pad disposed on the dielectric layer and immediately adjacent the first via;
a second via disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad, the second via offset from the second contact pad in a second direction that is opposite of the first direction, the first contact pad and the second contact pad comprising a first differential pair of contact pads configured to transmit a first differential pair of signals;
a third contact pad disposed on the dielectric layer;
a third via disposed through the dielectric layer and coupled to the third contact pad, the third via offset from the third contact pad in a third direction that is perpendicular to the first direction;
a fourth contact pad disposed on the dielectric layer and separated from the third contact pad by the first differential pair of contact pads; and
a fourth via disposed through the dielectric layer and coupled to the fourth contact pad, the fourth via offset from the fourth contact pad in a fourth direction that is perpendicular to the first direction, the third contact pad and the fourth contact pad configured to be coupled to ground.