US 11,812,542 B2
Circuit module
Shuichi Takizawa, Tokyo (JP); Hironori Sato, Tokyo (JP); Atsushi Yoshino, Tokyo (JP); and Hideki Kachi, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Feb. 2, 2023, as Appl. No. 18/104,956.
Application 18/104,956 is a continuation of application No. 17/352,982, filed on Jun. 21, 2021, granted, now 11,606,888.
Application 17/352,982 is a continuation of application No. 16/284,231, filed on Feb. 25, 2019, granted, now 11,076,513, issued on Jul. 27, 2021.
Claims priority of application No. 2018-033425 (JP), filed on Feb. 27, 2018.
Prior Publication US 2023/0189491 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 5/06 (2006.01); H05K 9/00 (2006.01); H05K 1/18 (2006.01)
CPC H05K 9/0045 (2013.01) [H05K 1/181 (2013.01); H05K 5/065 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A circuit module comprising:
a wiring structure;
at least one electronic component arranged on an upper surface of the wiring structure;
an insulating resin layer provided on the upper surface of the wiring structure and in which the at least one electronic component is embedded; and
a metal layer provided on an upper surface of the insulating resin layer,
wherein when a surface roughness of a portion directly above the at least one electronic component on the upper surface of the insulating resin layer is expressed as R1, and a surface roughness of a portion other than the portion directly above the at least one electronic component on the upper surface of the insulating resin layer is expressed as R2, at least one R1 satisfies the condition: R1>R2,
when a surface roughness of a portion directly above the at least one electronic component on an upper surface of the metal layer is expressed as R3, at least one R1 and R3 satisfy the condition: R1>R3, and
at least a part of au upper surface of the at least one electronic component has a concave or a convex configuration, and
the upper surface of the insulating resin layer above the at least one electronic component and the upper surface of the at least one electronic component has a corresponding shape.