US 11,812,541 B2
Electronic component tray
Yasuhiro Shimizu, Nagaokakyo (JP); and Kiyoyuki Nakagawa, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jun. 15, 2021, as Appl. No. 17/347,705.
Application 17/347,705 is a continuation of application No. PCT/JP2019/047774, filed on Dec. 6, 2019.
Claims priority of application No. 2018-238285 (JP), filed on Dec. 20, 2018.
Prior Publication US 2021/0315118 A1, Oct. 7, 2021
Int. Cl. B65D 73/02 (2006.01); H05K 5/03 (2006.01); H05K 5/06 (2006.01); B65D 43/02 (2006.01); B65D 75/36 (2006.01)
CPC H05K 5/03 (2013.01) [B65D 43/02 (2013.01); B65D 75/367 (2013.01); H05K 5/061 (2013.01); B65D 2575/365 (2013.01); B65D 2585/86 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component package, comprising:
an electronic component storage container including:
a main body including multiple recesses to store electronic components, the multiple recesses being positioned along a longitudinal direction of the main body and respectively including openings on one side in a height direction of the main body;
a cover sheet to cover the openings of the recesses and removably attached to the main body; and
a cover positioned such that the cover sheet is between the cover and the main body; and
electronic components stored in the recesses of the electronic component storage container; wherein
the electronic component package has a volume filling rate of the electronic components in at least one of the recesses of about 50% or higher.