US 11,812,238 B2
Impedance matching device, transducer device and method of manufacturing an impedance matching device
Severin Schweiger, Dresden (DE); Sandro Koch, Dresden (DE); Mario Grafe, Dresden (DE); Nicolas Lange, Dresden (DE); and Joerg Amelung, Dresden (DE)
Assigned to Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Munich (DE)
Filed by Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Munich (DE)
Filed on Nov. 3, 2020, as Appl. No. 17/088,352.
Application 17/088,352 is a continuation of application No. PCT/EP2019/061400, filed on May 3, 2019.
Claims priority of application No. 102018206937.9 (DE), filed on May 4, 2018.
Prior Publication US 2021/0051403 A1, Feb. 18, 2021
Int. Cl. G10K 11/02 (2006.01); H04R 3/00 (2006.01); H04R 3/02 (2006.01)
CPC H04R 3/02 (2013.01) [G10K 11/02 (2013.01)] 45 Claims
OG exemplary drawing
 
1. Impedance matching device for matching a characteristic acoustic impedance comprising:
an impedance matching body comprising a first side and an opposite second side,
the impedance matching device being configured to match a characteristic acoustic impedance of a medium contacted on the second side to a characteristic acoustic impedance of a sound transducer contacted on the first side;
wherein the impedance matching body comprises microstructures comprising structural extents of at most 500 nm along at least one spatial direction
wherein the microstructures are formed to comprise a first impedance matching material, wherein a second impedance matching material is disposed in intermediate regions between the microstructures; or
wherein the impedance matching body is formed in several layers comprising at least a first layer comprising a first layer characteristic impedance and a second layer comprising a second layer characteristic impedance different from the first layer characteristic impedance.