US 11,811,385 B2
Bulk acoustic wave component with conductor extending laterally from via
Atsushi Takano, Kadoma (JP); Takeshi Furusawa, Toyonaka (JP); and Mitsuhiro Furukawa, Nishinomiya (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Oct. 19, 2022, as Appl. No. 18/047,806.
Application 18/047,806 is a continuation of application No. 16/599,020, filed on Oct. 10, 2019, granted, now 11,496,111.
Claims priority of provisional application 62/747,486, filed on Oct. 18, 2018.
Prior Publication US 2023/0059917 A1, Feb. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/02 (2006.01); H03H 3/02 (2006.01); H03H 9/10 (2006.01); H03H 9/205 (2006.01); H03H 9/56 (2006.01); H03H 9/05 (2006.01); H10N 30/088 (2023.01); H04B 1/3827 (2015.01); H03F 3/20 (2006.01)
CPC H03H 9/02133 (2013.01) [H03H 3/02 (2013.01); H03H 9/02102 (2013.01); H03H 9/02125 (2013.01); H03H 9/0514 (2013.01); H03H 9/105 (2013.01); H03H 9/205 (2013.01); H03H 9/566 (2013.01); H10N 30/088 (2023.02); H03F 3/20 (2013.01); H03F 2200/451 (2013.01); H04B 1/3827 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bulk acoustic wave component comprising:
a substrate having a via extending therethrough;
at least one bulk acoustic wave resonator on the substrate;
a cap enclosing the at least one bulk acoustic wave resonator, the cap including a sidewall spaced apart from an edge of the substrate, the sidewall being 5 microns or less from the edge of the substrate; and
a conductor extending laterally from the via and electrically connected with a conductive layer in the via, the conductor being on an opposite side of the substrate than the at least one bulk acoustic wave resonator, the conductor having solder thereon, and the solder being non-overlapping with the via.