US 11,811,363 B2
Electronic component packages, electronic component, and oscillator
Shinya Aoki, Minowa (JP)
Assigned to SEIKO EPSON CORPORATION
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on May 25, 2022, as Appl. No. 17/752,895.
Claims priority of application No. 2021-088218 (JP), filed on May 26, 2021.
Prior Publication US 2022/0385235 A1, Dec. 1, 2022
Int. Cl. H03B 5/32 (2006.01); H01L 25/16 (2023.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01)
CPC H03B 5/32 (2013.01) [H01L 23/5383 (2013.01); H01L 25/165 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic component package comprising:
a lid;
a first layer;
a second layer disposed between the first layer and the lid and configuring a first frame, the first frame having a first corner portion, the first corner portion having a first inner diameter R1 in a plan view;
a third layer disposed between the second layer and the lid and configuring a second frame the second frame having a second corner portion, the second corner portion having a second inner diameter R2 in the plan view, the first corner portion overlapping the second corner portion in the plan view;
a bonding member bonding the third layer to the lid; and
a via wire electrically coupled to the lid and penetrating the second frame, wherein
R1<R2, and
an inner surface of the second corner portion is located closer to a center of the electronic component package than an inner surface of the first corner portion and the via wire in the plan view.