CPC H02H 3/08 (2013.01) [G01D 4/002 (2013.01); H01R 9/2658 (2013.01); H02B 1/26 (2013.01); H02J 13/00016 (2020.01); H04Q 9/00 (2013.01); H04Q 2209/60 (2013.01)] | 20 Claims |
1. A data acquisition module comprising:
a connection panel subassembly having a housing;
a computing device subassembly, electrically coupled to the connection panel subassembly and having a housing configured to mechanically couple to the housing of the connection panel assembly; and
a user interface subassembly, electrically coupled to the computing device subassembly and having a housing configured to mechanically couple to the housing of the computing device subassembly.
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