US 11,811,198 B2
High power laser array devices and methods
Shiyun Lin, San Diego, CA (US); and Tsurugi Sudo, San Jose, CA (US)
Assigned to II-VI DELAWARE, INC., Wilmington, DE (US)
Filed by FINISAR CORPORATION, Sunnyvale, CA (US)
Filed on Jun. 19, 2020, as Appl. No. 16/906,909.
Claims priority of provisional application 62/876,919, filed on Jul. 22, 2019.
Prior Publication US 2021/0028593 A1, Jan. 28, 2021
Int. Cl. H01S 5/026 (2006.01); H01S 5/40 (2006.01)
CPC H01S 5/4068 (2013.01) [H01S 5/026 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optoelectronic assembly comprising:
a single optoelectronic chip comprising:
a laser array including at least one primary laser and at least one spare laser configured to be activated when the primary laser fails, wherein the laser array is configured to transmit optical signals;
an amplifier array including a plurality of amplifiers, each configured to amplify the optical signals received from the laser array and output amplified optical signals; and
a multimode interference (MMI) coupler integral to the single optoelectronic chip, the MMI coupler configured to optically couple the laser array and the amplifier array;
a lens array comprising a plurality of optical lenses disposed adjacent to the amplifier array;
a fiber array comprising a plurality of optical fibers; and
an isolator disposed between the lens array and the fiber array,
wherein the isolator is configured to allow unidirectional travel of the amplified optical signals from the lens array to the fiber array.