US 11,811,192 B2
Diode laser assembly and method for assembling a diode laser assembly
Stephan Strohmaier, Berlin (DE); Arne-Heike Meissner-Schenk, Berlin (DE); Gerald Urban, Neuzelle (DE); Gerd Hansen, Berlin (DE); and Christian Carstens, Stahnsdorf (DE)
Assigned to TRUMPF Photonics, Inc., Cranbury, NJ (US)
Appl. No. 17/254,612
Filed by TRUMPF Photonics, Inc., Cranbury, NJ (US)
PCT Filed Jun. 18, 2019, PCT No. PCT/EP2019/066004
§ 371(c)(1), (2) Date Dec. 21, 2020,
PCT Pub. No. WO2019/243323, PCT Pub. Date Dec. 26, 2019.
Claims priority of application No. 10 2018 210 135.3 (DE), filed on Jun. 21, 2018.
Prior Publication US 2021/0257807 A1, Aug. 19, 2021
Int. Cl. H01S 5/024 (2006.01)
CPC H01S 5/024 (2013.01) [H01S 5/02415 (2013.01); H01S 5/02469 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A diode laser arrangement, comprising:
a diode laser device having a first diode main surface and a second diode main surface;
a first cooling element having a first outer surface with a first front region;
a second cooling element having a second outer surface with a second front region;
at least one spacing device;
said diode laser device and said at least one spacing device being mutually spaced apart between said first cooling element and said second cooling element;
said diode laser device and said at least one spacing device being disposed on said first outer surface and on said second outer surface;
said first cooling element and said second cooling element being configured to cool said diode laser device;
said diode laser device having at least one of said first diode main surface disposed on said first front region of said first outer surface or said second diode main surface disposed on said second front region of said second outer surface;
said at least one spacing device configured to orient said first cooling element and said second cooling element relative to one another to place at least one of said first front region of said first outer surface parallel to said first diode main surface or said second front region of said second outer surface parallel to said second diode main surface;
said at least one spacing device having a first contact surface disposed on said first outer surface and a second contact surface disposed on said second outer surface; and
at least one of said first contact surface being smaller than 1/10 of said first diode main surface or said second contact surface being smaller than 1/10 of said second diode main surface.