US 11,811,191 B2
Optical semiconductor device and carrier
Masahiro Hirayama, Yokohama (JP)
Assigned to SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC., Yokohama (JP)
Filed by SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC., Yokohama (JP)
Filed on Aug. 20, 2020, as Appl. No. 16/998,008.
Claims priority of application No. 2019-152028 (JP), filed on Aug. 22, 2019.
Prior Publication US 2021/0057877 A1, Feb. 25, 2021
Int. Cl. H01S 5/02345 (2021.01); H01S 5/026 (2006.01); H01S 5/0239 (2021.01)
CPC H01S 5/02345 (2021.01) [H01S 5/0239 (2021.01); H01S 5/0261 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An optical semiconductor device comprising:
a semiconductor laser chip;
an insulation substrate having a surface mounting the semiconductor laser chip thereon;
a ground pattern provided on the surface;
a mounted pattern provided on the surface, the mounted pattern having an opposite side opposite to the ground pattern;
a resistor disposed such that a side edge of the resistor separates from an extension region of the opposite side;
an extension ground pattern positioned in the extension region of the opposite side, the extension ground pattern being electrically connected to the ground pattern; and
a capacitor disposed on the mounted pattern,
wherein the extension ground pattern is a pair of extension ground patterns, and the pair of extension ground patterns sandwich the resistor therebetween.