US 11,811,132 B2
Radio frequency tuning using a multichip module electrical interconnect structure
Barbara Diane Young, Raymore, MO (US); Steven James Sedlock, Raymore, MO (US); Kevin Christopher Ledden, Raymore, MO (US); and Alan Ahlberg Elliot, Lees Summit, MO (US)
Assigned to Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed by Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed on Oct. 26, 2021, as Appl. No. 17/511,054.
Prior Publication US 2023/0128829 A1, Apr. 27, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/38 (2013.01); H01Q 1/422 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips, the method comprising:
determining a length and a center to center spacing for each of a plurality of interconnect traces;
determining a plurality of bond pad locations, each bond pad being located at one of opposing ends of a successive one of the interconnect traces;
applying an electrical insulator to an upper surface of the multichip module;
creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads;
applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases;
applying a layer of photoresist to an upper surface of the multichip module;
removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases;
applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces;
removing the bridge supports; and
disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.