CPC H01Q 1/2283 (2013.01) [H01Q 1/38 (2013.01); H01Q 1/422 (2013.01)] | 20 Claims |
1. A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips, the method comprising:
determining a length and a center to center spacing for each of a plurality of interconnect traces;
determining a plurality of bond pad locations, each bond pad being located at one of opposing ends of a successive one of the interconnect traces;
applying an electrical insulator to an upper surface of the multichip module;
creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads;
applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases;
applying a layer of photoresist to an upper surface of the multichip module;
removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases;
applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces;
removing the bridge supports; and
disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.
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