US 11,810,895 B2
Electrical interconnect structure using metal bridges to interconnect die
Barbara Diane Young, Raymore, MO (US); Steven James Sedlock, Raymore, MO (US); Kevin Christopher Ledden, Raymore, MO (US); and Alan Ahlberg Elliot, Lee's Summit, MO (US)
Assigned to Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed by Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed on Oct. 14, 2021, as Appl. No. 17/501,043.
Prior Publication US 2023/0121991 A1, Apr. 20, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/82 (2013.01) [H01L 24/24 (2013.01); H01L 25/0655 (2013.01); H01L 24/06 (2013.01); H01L 24/25 (2013.01); H01L 2224/06165 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/82002 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/82986 (2013.01); H01L 2924/3512 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multichip module comprising:
a carrier including a bottom wall and four side walls defining an internal cavity;
a plurality of chips positioned in the internal cavity, each chip including a plurality of bond pads;
an electrical insulating layer formed from electrically insulating material and positioned on an upper surface of the carrier and the chips; and
an electrical interconnect structure including a plurality of interconnect traces, each interconnect trace formed from electrically conductive material and electrically connected to a first bond pad on a first chip and a second bond pad on a second chip, wherein each interconnect trace includes a bridge having a segment that is spaced apart from, and positioned above, the electrical insulating layer, with the segment of the bridge being not in contact with any other object of the multichip module.