US 11,810,891 B2
Bond pads for low temperature hybrid bonding
Priyal Shah, Santa Clara, CA (US); and Milind S. Bhagavat, Broomfield, CO (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Mar. 2, 2021, as Appl. No. 17/189,324.
Application 17/189,324 is a division of application No. 16/023,399, filed on Jun. 29, 2018, granted, now 10,937,755.
Prior Publication US 2021/0183810 A1, Jun. 17, 2021
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/80 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 2224/0384 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05118 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/0614 (2013.01); H01L 2224/06515 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/8034 (2013.01); H01L 2224/8089 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80906 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of manufacturing, comprising:
fabricating first conductor pads in a first glass layer of a first semiconductor chip;
planarizing the first glass layer by chemical mechanical polishing;
planarizing the first glass layer and the first conductor pads by machining, the first conductor pads being configured to bumplessly connect to corresponding plural conductor pads of a second semiconductor chip to make up a plurality of interconnects that connect the first semiconductor chip to the second semiconductor chip;
treating the first glass layer to render the first glass layer hydrophillic to facilitate bonding to a second glass layer of the second semiconductor chip;
bonding the first glass layer to the second glass layer via a first annealing process at a first temperature; and
bonding the first conductor pads and the second conductor pads via a second annealing process at a second temperature different from the first temperature.