CPC H01L 24/80 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 2224/0384 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05118 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/0614 (2013.01); H01L 2224/06515 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/8034 (2013.01); H01L 2224/8089 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80906 (2013.01)] | 16 Claims |
1. A method of manufacturing, comprising:
fabricating first conductor pads in a first glass layer of a first semiconductor chip;
planarizing the first glass layer by chemical mechanical polishing;
planarizing the first glass layer and the first conductor pads by machining, the first conductor pads being configured to bumplessly connect to corresponding plural conductor pads of a second semiconductor chip to make up a plurality of interconnects that connect the first semiconductor chip to the second semiconductor chip;
treating the first glass layer to render the first glass layer hydrophillic to facilitate bonding to a second glass layer of the second semiconductor chip;
bonding the first glass layer to the second glass layer via a first annealing process at a first temperature; and
bonding the first conductor pads and the second conductor pads via a second annealing process at a second temperature different from the first temperature.
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