US 11,810,875 B2
Packaged integrated circuit device with built-in baluns
Waqas Hassan Syed, Eindhoven (NL); Cicero Silveira Vaucher, Eindhoven (NL); and Antonius Johannes Matheus de Graauw, Haelen (NL)
Assigned to NXP B.V., Eindhoven (NL)
Filed by NXP B.V., Eindhoven (NL)
Filed on Apr. 9, 2021, as Appl. No. 17/226,376.
Prior Publication US 2022/0328432 A1, Oct. 13, 2022
Int. Cl. H01L 23/66 (2006.01); G01S 7/02 (2006.01); G01S 13/931 (2020.01); H01L 23/498 (2006.01); H03H 7/42 (2006.01)
CPC H01L 23/66 (2013.01) [G01S 7/028 (2021.05); G01S 13/931 (2013.01); H01L 23/49816 (2013.01); H03H 7/42 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6638 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A packaged integrated circuit, comprising:
an integrated circuit (IC) die having a first external contact and a second external contact; a package substrate, wherein the IC die is attached to a first major surface of the package substrate, the package substrate including a balun in a first metal layer, wherein the balun is connected to the first and the second external contacts of the IC die and is connected to a first external contact of the package substrate, wherein the first and second external contacts of the IC die are configured to communicate a differential signal with the package substrate, and the first external contact of the package substrate is configured to communicate a single-ended signal corresponding to the differential signal.