US 11,810,864 B2
Semiconductor package
Changeun Joo, Cheonan-si (KR); and Gyujin Choi, Asan-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 27, 2022, as Appl. No. 17/849,938.
Application 17/849,938 is a continuation of application No. 17/032,210, filed on Sep. 25, 2020, granted, now 11,373,955.
Claims priority of application No. 10-2020-0022838 (KR), filed on Feb. 25, 2020.
Prior Publication US 2022/0328415 A1, Oct. 13, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 21/565 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first molding member having an upper surface and a lower surface opposite to each other, the first molding member having a cavity that extends from the lower surface of the first molding member to a predetermined depth;
a first semiconductor chip on the upper surface of the first molding member;
a second semiconductor chip within the cavity, wherein a first surface of the second semiconductor chip on which second chip pads are formed is exposed from the lower surface of the first molding member;
a second molding member on the upper surface of the first molding member and covering the first semiconductor chip;
a third molding member on the lower surface of the first molding member, the third molding member filling the cavity and covering the first surface of the second semiconductor chip;
first redistribution wirings on the second molding member and electrically connected to first chip pads of the first semiconductor chip;
second redistribution wirings on the third molding member and electrically connected to the second chip pads of the second semiconductor chip;
a lower redistribution wiring layer on the third molding member and having lower redistribution wirings electrically connected to the second redistribution wirings, respectively; and
connection wirings electrically connecting the first redistribution wirings and the second redistribution wirings.