US 11,810,862 B2
Electronic package and manufacturing method thereof
Yu-Lung Huang, Taichung (TW); Chih-Ming Huang, Taichung (TW); Kuo-Hua Yu, Taichung (TW); and Chang-Fu Lin, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Nov. 1, 2022, as Appl. No. 17/978,493.
Application 17/978,493 is a division of application No. 17/068,988, filed on Oct. 13, 2020, granted, now 11,521,930.
Claims priority of application No. 109129354 (TW), filed on Aug. 27, 2020.
Prior Publication US 2023/0053125 A1, Feb. 16, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/5381 (2013.01) [H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 21/4853 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic package, comprising:
providing a circuit board and at least one circuit block at a distance from one another on a carrier board, wherein the circuit board is formed with a plurality of grooves such that the plurality of grooves form a cross-shaped groove structure;
forming an encapsulating layer on the carrier board for encapsulating the circuit board and the circuit block, wherein the encapsulating layer has a first surface and a second surface opposite to each other, and the encapsulating layer is bonded onto the carrier board via the second surface;
forming a first circuit structure on the first surface of the encapsulating layer, the first circuit structure being electrically connected with the circuit board and the circuit block;
disposing an electronic component on the first circuit structure, the electronic component being electrically connected with the first circuit structure;
removing the carrier board; and
forming a second circuit structure on the second surface of the encapsulating layer, the second circuit structure being electrically connected with the circuit board and the circuit block.