US 11,810,849 B2
Connection structure and method of forming the same
Jongyoun Kim, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 5, 2022, as Appl. No. 17/857,696.
Application 17/857,696 is a continuation of application No. 17/085,436, filed on Oct. 30, 2020, granted, now 11,437,310.
Application 17/085,436 is a continuation of application No. 16/447,441, filed on Jun. 20, 2019, granted, now 10,833,002, issued on Nov. 10, 2020.
Claims priority of application No. 10-2018-0155947 (KR), filed on Dec. 6, 2018.
Prior Publication US 2022/0336338 A1, Oct. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/182 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48229 (2013.01); H05K 1/0284 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A connection structure comprising:
a first passivation layer comprises an opening;
a first conductive pattern that penetrates the first passivation layer and protrudes upwardly from the first passivation layer;
a second passivation layer on the first passivation layer and covering the first conductive pattern;
a second conductive pattern on the second passivation layer and electrically connected to the first conductive pattern;
a third passivation layer on the second passivation layer and covering the second conductive pattern;
a third conductive pattern on the third passivation layer and electrically connected to the second conductive pattern; and
an external terminal in the opening and electrically connected to the first conductive pattern,
wherein the first conductive pattern is thicker than the second conductive pattern, and the second conductive pattern is thicker than the third conductive pattern,
wherein a width of the first conductive pattern is greater than a width of the second conductive pattern, and the width of the second conductive pattern is equal to or greater than a width of the third conductive pattern, and
wherein a pitch between patterns of the first conductive pattern is greater than a pitch between patterns of the second conductive pattern, and the pitch between the patterns of the second conductive pattern is equal to or greater than a pitch between patterns of the third conductive pattern.