US 11,810,845 B2
Carrier, assembly comprising a substrate and a carrier, and method for producing a carrier
Jörg Erich Sorg, Regensburg (DE); Konrad Wagner, Regensburg (DE); Michael Förster, Altenthann (DE); and Josef Hirn, Schwandorf (DE)
Assigned to OSRAM OLED GMBH, Regensburg (DE)
Appl. No. 16/758,371
Filed by OSRAM OLED GmbH, Regensburg (DE)
PCT Filed Oct. 30, 2018, PCT No. PCT/EP2018/079710
§ 371(c)(1), (2) Date Apr. 22, 2020,
PCT Pub. No. WO2019/091830, PCT Pub. Date May 16, 2019.
Claims priority of application No. 10 2017 126 268.7 (DE), filed on Nov. 9, 2017.
Prior Publication US 2020/0266139 A1, Aug. 20, 2020
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 23/373 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 23/15 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/486 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 23/15 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 23/3733 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for producing a carrier comprising the steps:
A) providing an electrically conductive first auxiliary carrier;
B) arranging at least one thermal connection element on the first auxiliary carrier;
C) arranging at least one through-connection on the first auxiliary carrier;
D) applying a base material to the first auxiliary carrier, wherein the base material completely surrounds the through-connection and the thermal connection element in lateral directions;
E) applying contact structures on a side of the thermal connection element and the through-connection facing away from the first auxiliary carrier;
F) arranging a second auxiliary carrier on a side of the contact structures facing away from the first auxiliary carrier;
G) removing the first auxiliary carrier;
H) applying a metallization to a side of the thermal connection element and/or the through-connection facing away from the second auxiliary carrier; and
I) removing the second auxiliary carrier;
wherein
after step I) a substrate is arranged on a side of the metallization facing away from the base material, wherein the substrate comprises at least one conductor track and at least one heat sink;
the metallization, which is arranged in the region of the through-connection, is brought into direct contact with the conductor track; and
the metallization, which is arranged in the region of the thermal connection element, is brought into direct contact with the heat sink.