US 11,810,842 B2
Side-solderable leadless package
Henry Descalzo Bathan, Thousand Oaks, CA (US)
Assigned to Semtech Corporation, Camarillo, CA (US)
Filed by Semtech Corporation, Camarillo, CA (US)
Filed on Dec. 30, 2020, as Appl. No. 17/137,791.
Application 17/137,791 is a division of application No. 16/044,045, filed on Jul. 24, 2018, granted, now 10,892,211.
Claims priority of provisional application 62/543,211, filed on Aug. 9, 2017.
Prior Publication US 2021/0118776 A1, Apr. 22, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01)
CPC H01L 23/49565 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor die;
an encapsulant deposited over the semiconductor die; and
a plurality of contacts exposed from the encapsulant, wherein each of the plurality of contacts includes a half-etched portion forming a side surface that extends for an entire length or width of the encapsulant, wherein the side surface includes a convex U-shaped curve, and wherein the side surface includes a solder wettable layer formed over the side surface including on the convex U-shaped curve.