US 11,810,836 B2
Systems for providing thermal management to integrated circuits
Tiffany Doria, Fremont, CA (US); Robert Morris Wilcox, Saratoga, CA (US); Richard Neville Hibbs, Redwood City, CA (US); Tiong Khai Soo, Milpitas, CA (US); Ernest M. Thurlow, Mountain View, CA (US); and Zidong Lin, San Jose, CA (US)
Assigned to Arista Networks, Inc., Santa Clara, CA (US)
Filed by Arista Networks, Inc., Santa Clara, CA (US)
Filed on Jun. 9, 2020, as Appl. No. 16/896,637.
Prior Publication US 2021/0384104 A1, Dec. 9, 2021
Int. Cl. H01L 23/427 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H01L 23/427 (2013.01) [H01L 23/4006 (2013.01); H05K 1/0204 (2013.01); H05K 7/20154 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A compute unit comprising:
a printed circuit board (PCB) comprising an integrated circuit;
a first thermal management device, comprising:
a first vapor chamber thermally conductively coupled to a first side of the integrated circuit and having a first protrusion; and
a first heatsink thermally conductively coupled to the first vapor chamber; and
a second thermal management device, comprising:
a second vapor chamber having a second protrusion; and
a second heatsink thermally conductively coupled to the second vapor chamber,
wherein the PCB is interposed between the first thermal management device and the second thermal management device, and
wherein the PCB comprises a through hole through which the second protrusion of the second vapor chamber is thermally conductively coupled to the first protrusion of the first vapor chamber.