CPC H01L 23/3135 (2013.01) [H01L 21/56 (2013.01); H01L 23/18 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/8221 (2013.01); H01L 25/117 (2013.01); H01L 2225/06513 (2013.01)] | 20 Claims |
1. A package comprising:
a substrate;
a dam structure attached to the substrate;
a die stack attached to the substrate, the die stack being between portions of the dam structure, a topmost surface of the die stack being above a topmost surface of the dam structure, a topmost surface of at least one die of the die stack being below the topmost surface of the dam structure; and
a first encapsulant surrounding the die stack and extending between the dam structure and the die stack; and
a second encapsulant over the first encapsulant, wherein the second encapsulant extends along sidewalls of a topmost die of the die stack.
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