US 11,810,778 B2
Optical semiconductor element mounting package and optical semiconductor device using the same
Naoyuki Urasaki, Chikusei (JP); and Kanako Yuasa, Saitama (JP)
Assigned to Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen (CN)
Filed by Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen (CN)
Filed on Feb. 5, 2021, as Appl. No. 17/169,054.
Application 16/392,900 is a division of application No. 15/865,299, filed on Jan. 9, 2018, granted, now 10,326,063, issued on Jun. 18, 2019.
Application 15/865,299 is a division of application No. 15/603,618, filed on May 24, 2017, granted, now 10,205,072, issued on Feb. 12, 2019.
Application 15/603,618 is a division of application No. 12/303,188, granted, now 9,673,362, issued on Jun. 6, 2017, previously published as PCT/JP2007/060385, filed on May 21, 2007.
Application 17/169,054 is a continuation of application No. 16/392,900, filed on Apr. 24, 2019, granted, now 10,950,767.
Claims priority of application No. 2006-154652 (JP), filed on Jun. 2, 2006.
Prior Publication US 2021/0159374 A1, May 27, 2021
Int. Cl. H01L 23/48 (2006.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01)
CPC H01L 33/60 (2013.01) [H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 33/62 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating:
a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and
at least a pair of positive and negative lead electrodes disposed opposite to each other so as to form part of the bottom face of the recessed part, wherein there is no gap at a joint face between the resin molding and the lead electrodes, and an outer surface of the resin molding and an outer surface of the at least one of the lead electrodes are planar at an outer surface of the package,
wherein each one of the lead electrodes includes a metal film on a surface of the lead electrodes so as to form part of the bottom face of the recessed part, and
wherein the positive lead electrode has a first inner end, the negative lead electrode has a second inner end opposite to the first inner end of the positive lead electrode, and at least one side face of the first inner end and the second inner end is curved, and wherein the positive lead electrode and the negative lead electrode are not bent.