US 11,810,775 B2
High power module package structures
Yusheng Lin, Phoenix, AZ (US); and Jerome Teysseyre, Scottsdale, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Jul. 23, 2021, as Appl. No. 17/443,307.
Application 17/443,307 is a division of application No. 16/243,505, filed on Jan. 9, 2019, granted, now 11,075,137.
Application 16/243,505 is a continuation in part of application No. 16/145,918, filed on Sep. 28, 2018, granted, now 10,991,670, issued on Apr. 27, 2021.
Claims priority of provisional application 62/665,598, filed on May 2, 2018.
Prior Publication US 2021/0351101 A1, Nov. 11, 2021
Int. Cl. H01L 23/373 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 23/051 (2006.01); H01L 25/18 (2023.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 21/52 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/4334 (2013.01); H01L 23/49822 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H01L 2225/06589 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method, comprising:
disposing a semiconductor die and a conductive spacer between a first high voltage isolation carrier and a second high voltage isolation carrier, the semiconductor die being thermally coupled to the conductive spacer, the semiconductor die being electrically coupled to the first high voltage isolation carrier by a coupling layer;
disposing a first molding material in contact with the coupling layer in a space between the semiconductor die and the first high voltage isolation carrier, the first molding material being an electrically isolating material; and
encapsulating the first molding material and the conductive spacer with a second molding material, the second molding material being an electrically isolating material.