US 11,810,721 B2
Multilayer ceramic electronic component
Dongwoo Kang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 16, 2021, as Appl. No. 17/403,171.
Claims priority of application No. 10-2021-0016695 (KR), filed on Feb. 5, 2021.
Prior Publication US 2022/0254571 A1, Aug. 11, 2022
Int. Cl. H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H01G 4/248 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and first and second internal electrodes alternately laminated with the dielectric layer interposed therebetween;
a first external electrode connected to a first internal electrode of the ceramic body; and
a second external electrode connected to a second internal electrode,
wherein the first external electrode includes a first base electrode layer disposed to be in contact with the ceramic body and a first resin electrode layer disposed on the first base electrode layer,
wherein the second external electrode includes a second base electrode layer disposed to be in contact with the ceramic body and a second resin electrode layer disposed on the second base electrode layer,
wherein the first resin electrode layer and the second resin electrode layer include a thermosetting shape memory polymer,
wherein the thermosetting shape memory polymer has a glass transition temperature (Tg) of about 50° C. or more and/or about 200° C. or less,
wherein the thermosetting shape memory polymer includes an organic epoxy resin and a cured product of a curing agent, and
wherein the curing agent includes disulfide bonds.