CPC H01G 4/2325 (2013.01) [H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H01G 4/248 (2013.01)] | 18 Claims |
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and first and second internal electrodes alternately laminated with the dielectric layer interposed therebetween;
a first external electrode connected to a first internal electrode of the ceramic body; and
a second external electrode connected to a second internal electrode,
wherein the first external electrode includes a first base electrode layer disposed to be in contact with the ceramic body and a first resin electrode layer disposed on the first base electrode layer,
wherein the second external electrode includes a second base electrode layer disposed to be in contact with the ceramic body and a second resin electrode layer disposed on the second base electrode layer,
wherein the first resin electrode layer and the second resin electrode layer include a thermosetting shape memory polymer,
wherein the thermosetting shape memory polymer has a glass transition temperature (Tg) of about 50° C. or more and/or about 200° C. or less,
wherein the thermosetting shape memory polymer includes an organic epoxy resin and a cured product of a curing agent, and
wherein the curing agent includes disulfide bonds.
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