US 11,810,712 B2
Grooved, stacked-plate superconducting magnets and electrically conductive terminal blocks and related construction techniques
Brian Labombard, Belmont, MA (US); Robert S. Granetz, Newton, MA (US); James Irby, Natick, MA (US); Rui Vieira, Billierica, MA (US); William Beck, Watertown, MA (US); Daniel Brunner, Cambridge, MA (US); Jeffrey Doody, Melrose, MA (US); Martin Greenwald, Belmont, MA (US); Zachary Hartwig, Jamaica Plain, MA (US); Philip Michael, Cambridge, MA (US); Robert Mumgaard, Boston, MA (US); Alexey Radovinsky, Cambridge, MA (US); Shunichi Shiraiwa, Acton, MA (US); Brandon N. Sorbom, Cambridge, MA (US); John Wright, Melrose, MA (US); and Lihua Zhou, Woburn, MA (US)
Assigned to Massachusetts Institute of Technology, Cambridge, MA (US); and Commonwealth Fusion Systems LLC, Devens, MA (US)
Filed by Massachusetts Institute of Technology, Cambridge, MA (US); and Commonwealth Fusion Systems LLC, Cambridge, MA (US)
Filed on Jun. 30, 2022, as Appl. No. 17/810,038.
Application 17/810,038 is a continuation of application No. 17/345,194, filed on Jun. 11, 2021, granted, now 11,417,464.
Application 17/345,194 is a continuation of application No. 16/959,600, granted, now 11,094,439, issued on Aug. 17, 2021, previously published as PCT/US2019/068832, filed on Dec. 23, 2019.
Application 16/959,600 is a continuation of application No. 16/416,781, filed on May 20, 2019, abandoned.
Application 16/416,781 is a continuation in part of application No. 16/233,410, filed on Dec. 27, 2018, abandoned.
Application 16/959,600 is a continuation in part of application No. 16/233,410, filed on Dec. 27, 2018, abandoned.
Prior Publication US 2022/0336130 A1, Oct. 20, 2022
Int. Cl. H01F 41/04 (2006.01); H01F 6/04 (2006.01); H01F 6/06 (2006.01)
CPC H01F 6/06 (2013.01) [H01F 6/04 (2013.01); H01F 41/048 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a first electrically conductive plate having a first groove;
a first high-temperature superconductor (HTS) tape stack disposed in the first groove, the first HTS tape stack having a first plurality of turns;
a second electrically conductive plate having a second groove;
a second HTS tape stack disposed in the second groove, the second HTS tape stack having a second plurality of turns;
an electrically conductive connection between the first HTS tape stack and the second HTS tape stack; and
at least one cooling apparatus to cool at least one HTS tape stack.