US 11,810,249 B2
3D point cloud processing
Richard Wang, San Jose, CA (US); and Avideh Zakhor, Berkeley, CA (US)
Assigned to Signetron Inc., Berkeley, CA (US)
Filed by Signetron Inc., Berkeley, CA (US)
Filed on Jan. 3, 2022, as Appl. No. 17/567,748.
Prior Publication US 2023/0215088 A1, Jul. 6, 2023
Int. Cl. G06T 17/00 (2006.01)
CPC G06T 17/00 (2013.01) 19 Claims
OG exemplary drawing
 
1. A method for processing a 3D point cloud of a single building into polygons using an electronic computing device, the method comprising:
causing the electronic computing device to receive the 3D point cloud of the single building;
causing the electronic computing device to segment the 3D point cloud of the single building into a plurality of facades; and
causing the electronic computing device to generate a continuous boundary polygon for each of the plurality of façades of the single building representing a shape of a corresponding facade.