US 11,809,628 B2
See-through computer display systems
Ralph F. Osterhout, San Francisco, CA (US); Robert Michael Lohse, Palo Alto, CA (US); Nima Shams, San Jose, CA (US); John D. Haddick, Mill Valley, CA (US); and John N. Border, Eaton, NH (US)
Assigned to Mentor Acquisition One, LLC, Plantation, FL (US)
Filed by Mentor Acquisition One, LLC, Plantation, FL (US)
Filed on Jan. 14, 2022, as Appl. No. 17/576,849.
Application 17/576,849 is a continuation of application No. 16/867,498, filed on May 5, 2020, granted, now 11,262,846.
Application 16/867,498 is a continuation of application No. 14/559,126, filed on Dec. 3, 2014, granted, now 10,684,687, issued on Jun. 16, 2020.
Prior Publication US 2022/0197388 A1, Jun. 23, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/01 (2006.01); G06F 3/04842 (2022.01); G06F 3/0482 (2013.01); G06F 1/20 (2006.01); G06F 3/0354 (2013.01); G06F 1/16 (2006.01); G06F 3/03 (2006.01); G06F 3/038 (2013.01); G02B 27/01 (2006.01)
CPC G06F 3/016 (2013.01) [G06F 1/163 (2013.01); G06F 1/203 (2013.01); G06F 3/011 (2013.01); G06F 3/013 (2013.01); G06F 3/0304 (2013.01); G06F 3/0383 (2013.01); G06F 3/0386 (2013.01); G06F 3/03542 (2013.01); G06F 3/03545 (2013.01); G06F 3/0482 (2013.01); G06F 3/04842 (2013.01); G02B 2027/012 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wearable head device, comprising:
a frame;
a plurality of optical modules housed in the frame, each of the plurality of optical modules comprising a respective reflecting surface;
electronic components disposed adjacent to the frame and between two respective reflecting surfaces of the plurality of optical modules, the electronic components comprising a processor, the electronic components configured to rest within a first distance from the head of a user of the wearable head device; and
a heat sink disposed between the two respective reflecting surfaces of the plurality of optical modules and further configured to rest a second distance from the head of the user, the second distance greater than the first distance, the heat sink thermally coupled to the processor.